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China 310*320mm Panel Size Panel Level QFN Low Electrical Resistance for sale
310*320mm Panel Size Panel Level QFN Low Electrical Resistance
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    Company Details
    Company Name: Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
    Business Type: Manufacturer
    We Provide: Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability, Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump, Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball, Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package
    Employ Number: 101~120
    Annual Sales: 10000000-50000000
    Brand(s): FZX
    Year Established: 2018
    Address: Room A208,Science rearch Building,Building A of Foshan high-tech think tank center, nanhai software science park,Shishan Town,Nanhai District,Foshan city,Guangdong Province
    Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. in China
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    Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
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